Layout Guidelines for
Multi-Mix PICOTM Z-Series  
The published specifications for PICOTM Z-Series, surface mount components may be achieved given the following layout conditions. Transmission line connections to the ports must be maintained at 50 ohms, and sufficient grounding must be provided directly underneath the components for continuity and heat sinking. The transmission lines may be configured as microstrip or grounded coplanar waveguide, but CPWG provides the optimal match between the component and the parent board footprint. The ground pattern underneath the component must be properly connected to the bottom groundplane of the parent board, by means of plated through holes. Increasing the number of plated through holes minimizes ground inductance. Maximizing the plating thickness in the ground holes, increases the heat sinking ability of the assembly, and provides greater structural integrity.
Figure 1 illustrates an example of a parent board layout with an array of plated through ground holes. This layout is utilized when characterizing specifications for PICOTM Z-series products.
Substrate Material = Rogers RO4003; 0.020" Thickness;
1 oz. Electrodeposited Copper Feed Transmission Lines = Grounded CPW;
Line Width = 0.039" Line-Ground Spacing = 0.015"
Figure 2 illustrates 2 GHz surface current launched at each port to the ground pattern of the layout.
 
Sales
Merrimac Industries, Inc.
Tel: 1.888.434.MMFM - Fax: 973.882.5990
E-mail: sales@merrimacind.com
The Multi-Mix® Microtechnology Group is always interested in providing customers the products they need. If you do not find what you are looking for please feel free to contact us at sales@merrimacind.com. Please be sure to include all of your specifications.
|
