Multi-Mix PICO^® Zapper^® Couplers   

PICO® Zapper® Couplers
Model #	Frequency (GHz)	Mean Coupling (dB)	Insertion Loss (dB, Max)	VSWR Max	Frequency Sensitivity (dB, Max)	Directivity (dB, Min)	Outline (Inch)	Weight (Oz)
CSDZ-10Z-2.1G	2.0-2.3	10.0±1	0.2	1.25:1	±0.3	17	.175x.175x.043	0.003
CSDZ-10Z-2.45G	2.3-2.6	10.0±1	0.2	1.3:1	±0.25	17	.175x.175x.043	0.003
CSDZ-10Z-3.5G	3.3-3.7	10.0±1	0.25	1.3:1	±0.25	15	.175x.175x.043	0.003
CSDZ-10Z-5.5G	5.0-6.0	10.0±1	0.25	1.40:1	±0.25	13	.175x.175x.047	0.003
PICO® Inline Couplers
ILC-3SH-2.0G	1.8-2.0		0.35	1.45:1			.20x.56x.13	0.023

The Multi-Mix PICO^® Zapper^® CSDZ-Z series provides directional couplers with low insertion loss, low VSWR, and high power handling in a small outline. Precise coupling and frequency sensitivity make them ideal for applications involving power amplifiers, signal distribution and processing.

The Multi-Mix PICO^® ILC-SH series provides a power divider and combiner function with low insertion loss, high isolation, and high power handling in a small outline. The ILC series are composed of serial connected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do not. Accurate phase and amplitude balance make them ideal for applications involving power amplifiers, signal distribution and processing.

Both the CSDZ-Z series and the ILC-SH series are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.

Both series are easy to install SMDs designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.

Additional benefits include:

• Available on tape and reel
• Cost effective for commercial wireless applications
• Small outline size
• Operating temperature range -55°C to +85°C.
• Can be integrated with other Multi-Mix® components in a multi-function module

All Specifications Subject to Change

The Multi-Mix® Microtechnology Group is always interested in providing customers the products they need. If you do not find what you are looking for please feel free to contact us at crm@merrimacind.com. Please be sure to include all of your specifications.