Multi-Mix PICO^®                      

Introduction

Multi-Mix PICO^® is the next big leap for Multi-Mix technology. Multi-Mix PICO^® reduces the size of single-function microwave components from 84% to 87% compared to the previous Multi-Mix designs, which were until now the smallest in the industry. Merrimac accomplishes this without sacrificing performance. Multi-Mix PICO^® provides the highest power handling ability in the smallest footprint and overall size, and at the lowest cost of any other multilayer construction. Orders of magnitude reduction in size and cost provide greater value to our customers, which can be passed on to their customers.

Features Features of Multi-Mix PICO® and Multi-Mix PICO® components includes: Size reduction compared to conventional multilayer types Power handling ability of 100 Watts CW Competitive overall performance A standard footprint Library of proven, pre-engineered designs Delivered on tape and reel for automated manufacturing

Reliability

The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (>1000 cycles).

The Multi-Mix® Process

Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated through vias to form a SMD module that requires no additional packaging and is suitable for automated assembly.

Sales

Merrimac Industries, Inc.

Tel: 1.888.434.MMFM - Fax: 973.882.5990
E-mail: pico@merrimacind.com