Multi-Mix PICO^TM Products In A Nutshell

Our first Multi-Mix PICO^TM products include some basic and not-so-basic passive components that are designed to produce significant benefits to designers of wireless base stations and pico cells, multicarrier amplifiers, and other space-conscious applications.

QHD-Z Series 3-dB 90 and 180° Hybrids: A family of low-insertion loss, high-isolation hybrids in a tiny outline. Accurate phase and amplitude balance make them ideal for applications involving IQ networks, power amplifiers, and signal distribution and processing. They measure only 0.18 x 0.18 x 0.09 in.

CSD-Z Series Directional Couplers: Low insertion loss combined with low VSWR and precise coupling and frequency sensitivity make these couplers an excellent choice for power amplifiers, signal distribution, and processing. They measure only 0.18 x 0.18 x 0.07 in.

PDD-Z Series Power Dividers: In-phase, binary power dividers with low insertion loss in an outline 90 percent smaller than conventional designs. Accurate phase and amplitude balance ensure optimum performance of IQ networks, power amplifiers, and other areas of the transmission chain. They measure only 0.18 x 0.18 x 0.10 in.

ILC-SH Series In-Line Couplers: An integrated power divider and combiner that delivers high isolation, low insertion loss in an exceptionally small footprint. They measure only 0.20 x 0.56 x 0.13 in.

The HJD-Z Series provides a 3 dB hybrid junction with low insertion loss, high isolation, and high power handling in a small outline. Accurate phase and amplitude balance make them ideal for use in PCS power amplifiers, beamforming networks, matching baluns, signal distribution and processing functions. They measure only 0.18 x 0.18 x 0.11 in.

While the specifications for each Multi-Mix PICO^TM product varies with its component type, they share the following attributes:

• RF power handling ability for the majority of PICO^TM products of 100 W CW (heat sinked)
• Operating temperature range of -55o C to +85° C
• Designed to meet screening for thermal shock, burn-in, acceleration, vibration, mechanical shock, moisture resistance, resistance to solder heat, and thermal cycling lifetime (more than 1000 cycles)
• Available on tape and reel
• Significant cost savings up to 30-45%, even in quantities less than 250,000 pieces.
• A standard footprint
• A library of proven configurations ensures rapid turnaround for custom designs
• Standard configurations available from stock.

The Multi-Mix PICO^TM Story

About three years ago, Merrimac introduced Multi-Mix® Microtechnology, a process for fabricating microwave, multilayer integrated circuits and micro-multifunction modules (MMFM®) that deliver unprecedented benefits to designers by reducing the size and weight of microwave components, while also producing exceptional performance.

Multi-Mix® uses fluoropolymer composite substrates that are fusion-bonded together into a multilayer structure. Within these bonded multilayers can reside active and passive microwave components, MMICs, circuit patterns, and plated-through via holes that together form a surface mount module that is complete in itself - it requires no additional packaging, since the resulting MMFM structure becomes the package. This low-profile structure is compatible with microstrip or coplanar waveguide.

The Multi-Mix® concept produces advantages at every stage of the design and manufacturing process. It builds on a proven library of component designs and specifications, which can result in single-function devices such as directional couplers, filters, and quadrature hybrids, as well as complete "supercomponents" that perform several functions in a fraction of the size of other technologies.

The resulting products are ideally suited for high-volume automated manufacturing, and the time required from design specification to finished product can be substantially reduced. They can also be manufactured at much lower cost.

The first Multi-Mix® products have been well received by designers of base stations and other wireless products for which the benefits of small size, manufacturability, repeatability, and low cost are paramount concerns. Now Multi-Mix PICO^TM takes the Multi-Mix® concept a giant step toward the ultraminiaturization that is so critical in many applications.

Big Benefits From Tiny Components

The first Multi-Mix PICO^TM components, which Merrimac recently introduced, reduce the Multi-Mix® single-function component form factor by as much as 8l> components, which Merrimac recently introduced, reduce the Multi-Mix® single-function component form factor by as much as 87 percent. So Multi-Mix® components, which were already some of the smallest available, are now the smallest of their type achievable by any manufacturing process. They retain all of the advantages of Multi-Mix® technology, in a footprint that allows designers deliver more functionality in less space, with greater performance, than ever before.

To match your requirements for the capabilities of Multi-Mix PICO^TM, call us at (888) 434-6636, or send us an e-mail at MMFM@merrimacind.com.