News Release
FOR IMMEDIATE RELEASE
Contact: Mason N. Carter, Chairman & CEO
973-575-1300, ext. 1202
mnc@merrimacind.com
Merrimac Receives Research
and Development Award From Naval Surface Warfare Center
WEST CALDWELL, N.J., December 10, 2007:
Merrimac Industries, Inc. (Amex: MRM), a leader in the design
and manufacture of RF Microwave components, subsystem assemblies
and micro-multifunction modules (MMFM®), today announced that
it has received a research and development award from Naval
Surface Warfare Center, Crane Division (NSWC Crane) for Next
Generation Airborne Electronic Attack (NGAEA) Enabling Capability
(EC) Project utilizing Merrimac’s patented Multi-Mix®
Technology.
The NGAEA EC project is intended to develop
sub-system and component technologies to required levels of
technology and manufacturing readiness to support transition
to a Next Generation Jammer program (NGJ) capable of integration
on an airborne tactical platform with advanced levels of performance,
miniaturization, environmental ruggedness, reliability and
affordability. NGJ is intended to develop and field stand-off
and modified escort support jamming systems, with potential
application at the sub-system level to stand-in jamming systems.
Merrimac Chairman and CEO Mason N. Carter commented,
“This opportunity shows that Merrimac is eager to develop
advanced technologies with United States Government Agencies
that help the defense community forward the state-of-the-art
in military electronics. Our military customers and defense
agencies are confirming our longstanding belief that Multi-Mix®
is a catalyst for bringing new levels of integration to this
industry. We are pleased to see the growing utilization of
this technology.”
About Merrimac
Merrimac Industries, Inc. is a leader in the
design and manufacture of RF Microwave signal processing components,
subsystem assemblies, and Multi-Mix® micro-multifunction
modules (MMFM®), for the worldwide Defense, Satellite
Communications (Satcom), Commercial Wireless and Homeland
Security market segments. Merrimac is focused on providing
Total Integrated Packaging Solutions® with Multi-Mix®
Microtechnology, a leading edge competency providing value
to our customers through miniaturization and integration.
Multi-Mix® MMFM® provides a patented and novel packaging
technology that employs a platform modular architecture strategy
that incorporates embedded semiconductor devices, MMICs, resistors,
passive circuit elements and plated-through via holes to form
a three-dimensional integrated module used in High Power,
High Frequency and High Performance mission-critical applications.
Merrimac Industries facilities are registered under ISO 9001:2000,
an internationally developed set of quality criteria for manufacturing
operations.
Merrimac Industries, Inc. has facilities located
in West Caldwell, NJ and San Jose, Costa Rica and has approximately
180 co-workers dedicated to the design and manufacture of
signal processing components, gold plating of high-frequency
microstrip and bonded stripline Teflon (PTFE) circuits and
subsystems providing Total Integrated Packaging Solutions®
for wireless applications. Merrimac (MRM) is listed on the
American Stock Exchange. Multi-Mix®, Multi-Mix PICO®,
MMFM®, System In A Package®, SIP® and Total Integrated
Packaging Solutions® are registered trademarks of Merrimac
Industries, Inc. For more information about Merrimac Industries,
Inc. please visit our website http://www.merrimacind.com
This press release contains statements relating
to future results of the Company (including certain projections
and business trends) that are "forward-looking statements"
as defined in the Private Securities Litigation Reform Act
of 1995. Actual results may differ materially from those projected
as a result of certain risks and uncertainties. These risks
and uncertainties include, but are not limited to: risks associated
with demand for and market acceptance of existing and newly
developed products as to which the Company has made significant
investments, particularly its Multi-Mix® products; the
possibilities of impairment charges to the carrying value
of our Multi-Mix® assets, thereby resulting in charges
to our earnings; risks associated with adequate capacity to
obtain raw materials and reduced control over delivery schedules
and costs due to reliance on sole source or limited suppliers;
slower than anticipated penetration into the satellite communications,
defense and wireless markets; failure of our Original Equipment
Manufacturer or OEM customers to successfully incorporate
our products into their systems; changes in product mix resulting
in unexpected engineering and research and development costs;
delays and increased costs in product development, engineering
and production; reliance on a small number of significant
customers; the emergence of new or stronger competitors as
a result of consolidation movements in the market; the timing
and market acceptance of our or our OEM customers’ new
or enhanced products; general economic and industry conditions;
the ability to protect proprietary information and technology;
competitive products and pricing pressures; our ability and
the ability of our OEM customers to keep pace with the rapid
technological changes and short product life cycles in our
industry and gain market acceptance for new products and technologies;
risks relating to governmental regulatory actions in communications
and defense programs; and inventory risks due to technological
innovation and product obsolescence, as well as other risks
and uncertainties as are detailed from time to time in the
Company's Securities and Exchange Commission filings. These
forward-looking statements are made only as of the date hereof,
and the Company undertakes no obligation to update or revise
the forward-looking statements, whether as a result of new
information, future events or otherwise.
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