Merrimac Expands Multi-Mix® PICO Line for Wireless Network Solutions

WEST CALDWELL, N.J., October 2, 2001: Merrimac Industries, Inc. (AMEX: MRM), today announced its latest Multi-Mix PICO® Wireless Network Solution. The Multi-Mix PICO^TM ILC-3SH-2.0G multicoupler reduces the size of conventional multilayer splitters/combiners by 62 times while offering customized power levels from 10-100 Watts CW.

This revolutionary breakthrough in microwave design and manufacturing provides the smallest footprint, lowest cost and most flexibility of any multicoupler splitter/combiner available today.

Multi-Mix PICO in-line multicoupler complements Merrimac's recent announcement of its Multi-Mix PICO quadrature hybrids, directional couplers, and power divider product lines.

Multi-Mix PICO ILC-3SH-2.0G provides the following advantages:

62 Times Smaller When Compared to Conventional Multilayer Types
Power can be customized to meet customer requirements (10-100 Watts CW input power when used as a divider)
Substantial Cost Savings
Standard Size Multi-Mix PICO Z-Series Building Block Architecture...Micro-Multifunction Modules (MMFM®) for Total Integrated Packaging Solutions^TM

Mason N. Carter, Chairman and CEO commented, "Performance is optimized for operation in the 1.8-2.0GHz frequency band. Amplitude balance, low VSWR, low insertion loss, and high isolation make them ideal for applications involving feed forward power amplifiers for GSM, PCS, and WCDMA applications."

Carter continued, "Multi-Mix PICO ILC-SH series in-line multicouplers provide solutions for signal distribution and processing applications; such as, multi-carrier power amplifiers (MCPA) where the signal is split, amplified and then combined to achieve higher power. The Multi-Mix PICO ILC-SH series provides a power divider and combiner function connected in series and integrated into a Total Integrated Packaging Solution^TM with low insertion loss, high isolation, and high power handling in a small outline. The small size of the PICO ILC-SH series in-line multicouplers offers advantages in reducing the size and cost of basestations.

The need for more basestations will increase with deployment of GSM, CDMA and 3G installations. Mobile subscribers in our cities and on our highways are expected to increase dramatically over the next few years. Size and cost will become a determining factor in new basestation designs."

Multi-Mix® is a highly efficient proven technology that uses significantly less material and reduces the size and weight of microwave components, while increasing performance and reducing manufacturing cost. Multi-Mix PICO products are a quantum leap in Multi- Mix technology. These standard products are mounted on tape and reel. By utilizing Multi-Mix platform designs, Merrimac is able to offer its customers substantial value. Size reduction for the Multi-Mix PICO Z-Series product line translates into less material usage and lower cost. These savings, along with other process efficiencies, will benefit Merrimac's customers.

Carter stated, "Other soon to be announced Multi-Mix PICO products are phase shifters, hybrid junctions and MMFMs. Merrimac is setting the standard by providing innovative RF Microwave design engineers and decision-makers alternatives to conventional, bulky, high-priced components and multifunction modules. The size and power advantages offered by the PICO product line provides design engineers the opportunity to optimize the performance of their basestation designs while reducing size, weight and cost."

To subscribe to Merrimac's electronic newsletter, please visit www.merrimacind.com.

About Merrimac

Merrimac Industries, Inc. is a leader in the design and manufacture of Multi-Mix PICO RF Microwave components, assemblies and micro-multifunction modules (MMFM), serving wireless telecommunications industry worldwide with enabling technologies for commercial applications. Merrimac is focused on providing Total Integrated Packaging Solutions^TM with Multi-Mix® Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration. The Multi-Mix process for microwave, multilayer integrated MMFM circuitry is a patented method developed by Merrimac Industries based on fluoropolymer composite substrates. The fusion bonding of multilayer structures provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies. The bonded layers may incorporate embedded semiconductor devices, MMICs, etched resistors, passive circuit elements and plated- through via holes to form a three-dimensional subsystem enclosure that requires no further packaging. Merrimac Industries facilities are registered under ISO 9000, an internationally developed set of quality criteria for manufacturing operations.

Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc., with locations in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario, Canada, have approximately 240 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high-frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing Total Integrated Packaging Solutions for wireless applications. Merrimac (MRM) is listed on The American Stock Exchange. Multi-Mix, Multi-Mix PICO, MMFM and Total Integrated Packaging Solutions are trademarks of Merrimac Industries, Inc. For more information about Merrimac Industries, Inc. and Filtran Microcircuits Inc., please visit www.merrimacind.com and www.filtranmicro.com

This press release contains statements relating to future results of the Company (including certain projections and business trends) that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: general economic and industry conditions; slower than anticipated penetration into the satellite communications, defense and wireless markets; the risk that the benefits expected from the acquisition of Filtran Microcircuits Inc. are not realized; the ability to protect proprietary information and technology; competitive products and pricing pressures; the risk that the Company will not be able to continue to raise sufficient capital to expand its operations as currently contemplated by its business strategy; risks relating to governmental regulatory actions in communications and defense programs; risks associated with demand for and market acceptance of existing and newly developed products; and inventory risks due to technological innovation and product obsolescence, as well as other risks and uncertainties, including but not limited to those detailed from time to time in the Company's Securities and Exchange Commission filings. These forward-looking statements are made only as of the date hereof, and the Company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

Note: These news releases are also available on the Internet at: http://www.prnewswire.com

Contact:

Merrimac Industries, Inc.
Mason N. Carter, Chairman & CEO
973.575.1300, Ext. 1202
E-mail: mnc@merrimacind.com