Merrimac Sets Industry Standard for Miniature Power Dividers

WEST CALDWELL, N.J., September 6, 2001: Merrimac Industries, Inc. (AMEX: MRM), a leader in the design and manufacture of RF Microwave components, assemblies and micro-multifunction modules (MMFM®), announced today that it has designed and successfully tested a new line of Multi-Mix PICO^TM 2-way and 3-way power dividers, which reduce the sizes of conventional multilayer power dividers by 90 percent while maintaining excellent performance.

Multi-Mix PICO PDD-3Z-1.9G reduces significant space needed on a circuit board by utilizing a footprint measuring 0.18 inches square and 0.10 inches high. Performance is optimized for operation in the 1.9GHz frequency band. This revolutionary breakthrough in microwave design and manufacturing provides the smallest footprint and lowest cost of any multilayer power divider construction available today. Multi-Mix PICO 2-way and 3-way power dividers compliment Merrimac's recent announcement of its Multi-Mix PICO quadrature hybrids and directional couplers product line.

Multi-Mix PICO PDD-3Z-1.9G provides the following advantages:

90 Percent Size Reduction Compared to Conventional Multilayer Types
Low Insertion Loss (0.35dB)
High Isolation (16dB)
Excellent Phase (3°) and Amplitude Balance (± 0.5dB)
Cost Savings (30 percent)
Standard Size Multi-Mix PICO Z-Series Building Block Architecture...Micro-Multifunction Modules (MMFM®) for Total Integrated Packaging Solutions^TM

Multi-Mix® is a highly efficient proven technology that uses significantly less material and reduces the size and weight of microwave components, while increasing performance and reducing manufacturing cost. Multi-Mix PICO products are a quantum leap in Multi-Mix technology. These standard products are mounted on tape and reel. By utilizing Multi-Mix platform designs, Merrimac is able to offer its customers substantial value. Size reduction for the Multi-Mix PICO Z-Series product line translates into less material usage and lower cost. These savings along with other process efficiencies will benefit Merrimac's customers.

Multi-Mix PICO 2-way and 3-way power dividers are available immediately. Samples are available for qualified product designs.

Mason N. Carter, Chairman and CEO commented, "The ability to design and manufacture power dividers with the same standard footprint as our other Multi-Mix PICO products offers substantial board space savings when compared to what is currently offered by other companies. Multi-Mix PICO power dividers enable design engineers to reduce their circuit designs and add more functionality to their systems while reducing product and process costs."

Carter stated, "As we continue to miniaturize these products, we see even more cost savings as design engineers look to take full advantage of the size, cost benefits and embedded functionality of Multi-Mix by asking us to further integrate their designs into 3D multilayer micro-multifunction modules.

"Other soon to be announced Multi-Mix PICO products are in-line multicouplers, phase shifters, hybrid junctions and MMFMs. Merrimac is setting the standard by providing innovative RF Microwave design engineers and decision makers alternatives to conventional, bulky, high-priced components and multifunction modules."

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About Merrimac

Merrimac Industries, Inc. is a leader in the design and manufacture of Multi-Mix PICO RF Microwave components, assemblies and micro-multifunction modules (MMFM), serving the wireless telecommunications industry worldwide with enabling technologies for commercial applications. Merrimac is focused on providing Total Integrated Packaging Solutions^TM with Multi-Mix® Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration. The Multi-Mix process for microwave, multilayer integrated MMFM circuitry is a patented method developed by Merrimac Industries based on fluoropolymer composite substrates. The fusion bonding of multilayer structures provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies. The bonded layers may incorporate embedded semiconductor devices, MMICs, etched resistors, passive circuit elements and plated-through via holes to form a three-dimensional subsystem enclosure that requires no further packaging. Merrimac Industries facilities are registered under ISO 9000, an internationally developed set of quality criteria for manufacturing operations.

Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc., with locations in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario, Canada, have approximately 240 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high-frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing Total Integrated Packaging Solutions for wireless applications. Merrimac (MRM) is listed on The American Stock Exchange. Multi-Mix, Multi-Mix PICO, MMFM and Total Integrated Packaging Solutions are trademarks of Merrimac Industries, Inc. For more information about Merrimac Industries, Inc. and Filtran Microcircuits Inc., www.merrimacind.com and www.filtranmicro.com

This press release contains statements relating to future results of the Company (including certain projections and business trends) that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: general economic and industry conditions; slower than anticipated penetration into the satellite communications, defense and wireless markets; the risk that the benefits expected from the acquisition of Filtran Microcircuits Inc. are not realized; the ability to protect proprietary information and technology; competitive products and pricing pressures; the risk that the Company will not be able to continue to raise sufficient capital to expand its operations as currently contemplated by its business strategy; risks relating to governmental regulatory actions in communications and defense programs; risks associated with demand for and market acceptance of existing and newly developed products; and inventory risks due to technological innovation and product obsolescence, as well as other risks and uncertainties, including but not limited to those detailed from time to time in the Company's Securities and Exchange Commission filings. These forward-looking statements are made only as of the date hereof, and the Company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

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Contact:

Merrimac Industries, Inc.
Mason N. Carter, Chairman & CEO
973.575.1300, Ext. 1202
E-mail: mnc@merrimacind.com