News Release
Merrimac Multi-Mix® Microtechnology
Granted
Patent For Resource Module
WEST CALDWELL, N.J., June 13, 2006:
Merrimac Industries, Inc. (AMEX: MRM), today announced it
has been granted a patent for its Multi-Mix® Microtechnology
from the United States Patent and Trademark Office entitled
“Coupler Resource Module”.
 The
advanced capabilities of Multi-Mix® proprietary integrated
platform technology provide low cost high-power RF amplifier
circuitry with best in class performance and density in small
lightweight modules. The Resource Module is the foundation
or the building block for providing Total Integrated Platform
Solutions for a wide range of RF and Microwave subsystems.
Based on Multi-Mix® proprietary PTFE process technology
the Resource Module paves the way for direct integration of
high power RF circuitry with transistor die in small lightweight
modules thereby eliminating discrete transistor packages and
solutions.
Using this pioneering technology, high power
amplifier assemblies can be replaced with small, low cost
integrated power amplifier modules exhibiting higher electrical
performance and a level of reliability previously unattainable
using traditional technologies. The resource module exhibits
high temperature resistance, thermal stability and superior
homogeneity. These characteristics potentially offer the best
platform solution for high power amplifier applications for
wireless infrastructure and WiMAX base stations, radar transmitters,
digital TV transmitters, Homeland Security base stations,
etc.
The Multi-Mix® PTFE structure of the resource
module is CTE matched with a wide range of semiconductor technologies
such as LDMOS, GaN, SiC, SiGe, GaAs FET/MESFET and PHEMT,
and allows for mixed and multiple die integration on a single
platform. The potential applications of the Resource Module
exceed those of high power amplifiers. High power PIN diode
switches, attenuators, and oscillators as well as radio transceivers,
phase shifters, and phased array radar elements for both commercial
and military applications can now be integrated in small,
low-cost surface mount modules with internal fusion bonded
heatsink. The Resource Module is where RF power semiconductor
chip and the high power RF circuitry directly converge onto
one platform.
Chairman and CEO Mason N. Carter commented,
“We see an increasing trend towards integration of base
station RF subsystems, and our Resource Module is in the right
place at the right time to meet market needs and challenges.
Consistent and stable production of high power integrated
module products by virtue of low-cost Multi-Mix® manufacturing
will help our customers achieve price leadership. We expect
the Resource Module to play a key role in our future offerings
as we seek to grow our market share.”
Mr. Carter further commented, “By introducing
the Resource Module to the marketplace we are already creating
a paradigm shift in the design and integration of high power
RF amplifiers for wireless infrastructure base stations. The
value benefit our Resource Module offers base station OEMs
in such applications as power amplifiers, tower- mounted boosters
and T/R modules far exceeds the cost of goods of corresponding
discrete solutions. These benefits include size and weight
reduction of base station equipment, opportunities for higher
level of integration, reduced development costs, reduced time-to-market,
and all in all enables OEMs to realize significant cost savings.”
Mr. Carter also commented, “Due to the
high power, small size, lightweight, low cost, and integrated
platform flexibility of the Resource Module, we have just
started to explore potential applications in Unmanned Air
Vehicles (UAV’s).”
About Merrimac
Merrimac Industries, Inc. is a leader in the design and manufacture
of RF Microwave signal processing components, subsystem assemblies,
and Multi-Mix® micro-multifunction modules (MMFM®),
for the worldwide Defense, Satellite Communications (Satcom),
Commercial Wireless and Homeland Security market segments.
Merrimac is focused on providing Total Integrated Packaging
Solutions® with Multi-Mix® Microtechnology, a leading
edge competency providing value to our customers through miniaturization
and integration. Multi-Mix® MMFM® provides a patented
and novel packaging technology that employs a platform modular
architecture strategy that incorporates embedded semiconductor
devices, MMICs, etched resistors, passive circuit elements
and plated-through via holes to form a three-dimensional integrated
module used in High Power, High Frequency and High Performance
mission-critical applications. Merrimac Industries facilities
are registered under ISO 9001:2000, an internationally developed
set of quality criteria for manufacturing operations.
Merrimac Industries, Inc. has facilities located
in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario,
Canada, and has approximately 230 co-workers dedicated to
the design and manufacture of signal processing components,
gold plating of high-frequency microstrip, bonded stripline
and thick metal-backed Teflon (PTFE) micro-circuitry and subsystems
providing Total Integrated Packaging Solutions® for wireless
applications. Merrimac (MRM) is listed on the American Stock
Exchange. Multi-Mix®, Multi-Mix PICO®, MMFM®,
System In A Package®, SIP® and Total Integrated Packaging
Solutions® are registered trademarks of Merrimac Industries,
Inc. For more information about Merrimac Industries, Inc.
and its Canadian subsidiary Filtran Microcircuits Inc., please
visit http://www.merrimacind.com and http://www.filtranmicro.com
.
Contact:
Mason N. Carter, Chairman & CEO
973.575.1300, ext. 1202
E-mail: mnc@merrimacind.com
This press release contains statements relating
to future results of the Company (including certain projections
and business trends) that are "forward-looking statements"
as defined in the Private Securities Litigation Reform Act
of 1995. Actual results may differ materially from those projected
as a result of certain risks and uncertainties. These risks
and uncertainties include, but are not limited to: risks associated
with demand for and market acceptance of existing and newly
developed products as to which the Company has made significant
investments, particularly its Multi-Mix® products; the
possibilities of impairment charges to the carrying value
of our Multi-Mix® assets, thereby resulting in charges
to our earnings; risks associated with adequate capacity to
obtain raw materials and reduced control over delivery schedules
and costs due to reliance on sole source or limited suppliers;
slower than anticipated penetration into the satellite communications,
defense and wireless markets; failure of our Original Equipment
Manufacturer, or OEM, customers to successfully incorporate
our products into their systems; changes in product mix resulting
in unexpected engineering and research and development costs;
delays and increased costs in product development, engineering
and production; reliance on a small number of significant
customers; the emergence of new or stronger competitors as
a result of consolidation movements in the market; the timing
and market acceptance of our or our OEM customers’ new
or enhanced products; general economic and industry conditions;
the risk that the benefits expected from the Company’s
acquisition of Filtran Microcircuits Inc. are not realized;
the ability to protect proprietary information and technology;
competitive products and pricing pressures; our ability and
the ability of our OEM customers to keep pace with the rapid
technological changes and short product life cycles in our
industry and gain market acceptance for new products and technologies;
foreign currency fluctuations between the U.S. and Canadian
dollars; risks relating to governmental regulatory actions
in communications and defense programs; and inventory risks
due to technological innovation and product obsolescence,
as well as other risks and uncertainties as are detailed from
time to time in the Company's Securities and Exchange Commission
filings. These forward-looking statements are made only as
of the date hereof, and the Company undertakes no obligation
to update or revise the forward-looking statements, whether
as a result of new information, future events or otherwise.
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