Merrimac Unveils Unique Internet Service

WEST CALDWELL, NJ (June 3, 1999) - Merrimac Industries, Inc. (Amex: MRM; News) has launched a one of a kind service which allows customers to design and test Multi-Mix® Microtechnology over the Internet. This free service, On-Line Co-Design®, provides customers with the ability to create Multi-Mix® multilayer designs from pre-engineered standard platforms and a 90,000 part reference library.

Mason N. Carter, Chairman and CEO stated that "On-Line Co-Design® fosters relationship development and partnering with our key accounts. It provides an easy-to-use tool that encourages "out-of-the-box thinking" for both customer engineers and our Multi-Mix® design team. The ability to co-design facilitates early involvement creating optimal total integrated packaging solutions. Most important to all of our key accounts is that time to market is dramatically reduced."

"The unique advantages of Multi-Mix® can be maximized with software used to drive On-Line Co-Design® such as design tools offered by Hewlett Packard’s EEsof Series Division", stated Richard E. Dec, Vice President of Marketing. He added, "We are very pleased that Hewlett-Packard agreed to work with us to develop On-Line Co-Design® , because the HP EEsof suite of state-of-the-art design tools is widely respected throughout the world’s RF and microwave engineering communities."

Multi-Mix® is a microwave design and manufacturing process based on fluoropolymer composite substrates that are fusion-bonded together into a planar, multilayer structure. The fusion process provides a homogeneous dielectric medium that yields superior electrical performance at microwave and millimeter-wave frequencies. The bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-through via holes.

The resulting circuit becomes a self-contained surface-mount module that requires no additional packaging and can be placed on the circuit board automatically with standard pick-and-place equipment. The small-outline, low-profile structure created with Multi-Mix® technology is lightweight, and the surface-mount format is compatible with microstrip or coplanar waveguide. Subsystems designed with Multi-Mix® have produced savings in size and weight of greater than an order of magnitude when compared to the same subsystem designed with conventional microwave fabrication techniques. The Multi-Mix® process lends itself well to both low-volume and high-volume production, and allows modifications to be made to existing designs without extensive rework.

On-Line Co-Design® makes it possible for designers to select and place RF components as well as specially-shaped, dimensionally-controlled multilayer circuit elements, including dielectrics, passive networks and components, interconnects, and transmission line components, that are unique to Multi-Mix® . Once the circuit is simulated, performance can be analyzed and optimized, and the customer has the choice of either finishing the design, or allowing Merrimac’s engineers to do so.

On-Line Co-Design® is available to key Merrimac customers, and is supported by dedicated engineering staff at the company. After customizing their personal profile in the Merrimac On-Line Co-Design® system and choosing a password, customers simply log-on to On-Line Co-Design® from their browser, and begin working. All files are saved in the On-Line Co-Design® server, and are hardware and software protected.

About Merrimac

Merrimac Industries, Inc. is a leader in the design and manufacture of RF Microwave components, assemblies and Micro-Multifunction (MMFM®) Modules serving the wireless telecommunications industry worldwide with enabling technologies for commercial applications. Merrimac is focused on providing Total Integrated Packaging Solutions^TM with Multi-Mix® Microtechnology, a leading edge competency providing value to our customers through miniaturization and integration. The Multi-Mix® process for microwave, multilayer integrated MMFM® circuits is a patented method developed at Merrimac Industries based on fluoropolymer composite substrates. The fusion bonding of multilayer structures provides a homogeneous dielectric medium for superior electrical performance at microwave frequencies. The bonded layers may incorporate embedded semiconductor devices, MMICs, etched resistors, passive circuit elements and plated-through via holes to form a three-dimensional subsystem enclosure that requires no further packaging. Merrimac Industries, Inc. is ISO 9001 certified.

Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc., with locations in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario, Canada, have approximately 260 co-workers dedicated to the design and manufacture of signal processing components, gold plating of high frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing Total Integrated Packaging Solutions^TM wireless applications. Merrimac (MRM) is listed on the American Stock Exchange. For more information about Merrimac Industries, visit its home page at www.merrimacind.com.

This press release contains statements relating to future results of Merrimac (including certain projections and business trends) that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: general economic and industry conditions; slower than anticipated penetration into the satellite communications, defense and wireless markets; the risk that the benefits expected from the acquisition of Filtran Microcircuits Inc. are not realized; the ability to protect proprietary information and technology; competitive products and pricing pressures; risks relating to governmental regulatory actions in communications and defense programs; and inventory risks due to technological innovation, as well as other risks and uncertainties, including but not limited to those detailed from time to time in Merrimac's Securities and Exchange Commission filings. These forward-looking statements are made only as of the date hereof, and Merrimac undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

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Contacts

Mason N. Carter, Chairman and CEO,
Tel: 973.575.1300, Ext. 1202; Fax: 973.882.5989
E-mail: mnc@merrimacind.com