News Release
Merrimac Receives $1.3 Million
GPS Satellite Order From Boeing
WEST CALDWELL, N.J., January 19, 2005:
Merrimac Industries, Inc. (AMEX: MRM), today announced that it received an order valued at $1.3 million from The Boeing Company (NYSE: BA) Integrated Defense Systems, Huntington Beach, California, to supply Beamforming Networks and RF/ Microwave signal processing components on Boeing's GPS (Global Positioning System) IIF Satellites.
Boeing exercised its second contract option for Merrimac to provide additional signal processing components on Space Vehicles 7, 8, and 9. Under a contract awarded by the U.S. Air Force, Boeing is currently building the third group of GPS IIF satellites, with a potential total of up to 12 satellites. Today's order is part of the contract from Boeing estimated to reach $4.4 million that Merrimac announced on September 3, 2003.
Designed for flexibility and growth, the IIF satellites will provide new capabilities, including improved anti-jam, increased accuracy, higher integrity and critical secure Operational Military codes.
Chairman and CEO Mason N. Carter commented, "Merrimac continues to be a strategic supplier to The Boeing Company on the U.S. Air Force GPS Block IIF, Satellite Program and we look forward to continuing our assembly of the next three satellites in 2005, with a potential for up to three additional Boeing IIF satellites through 2006."
Mr. Carter added, "Our process and management teams continue to work very closely with Boeing in meeting and exceeding Boeing's expectations. We look forward to continuing to work with Boeing through the completion of this important navigation satellite program."
About Merrimac
Merrimac
Industries, Inc. is a leader in the design and manufacture
of Multi-Mix PICO™ RF Microwave components, assemblies
and micro-multifunction modules (MMFM), serving the wireless
telecommunications industry worldwide with enabling technologies
for space, defense and commercial applications. Merrimac is
focused on providing Total Integrated Packaging Solutions®
with Multi-Mix® Microtechnology, a leading edge competency
providing value to our customers through miniaturization and
integration. The Multi-Mix® process for microwave, multilayer
integrated MMFM circuitry is a patented method developed by
Merrimac Industries based on fluoropolymer composite substrates.
The fusion bonding of multilayer structures provides a homogeneous
dielectric medium for superior electrical performance at microwave
frequencies. The bonded layers may incorporate embedded semiconductor
devices, MMICs, etched resistors, passive circuit elements
and plated-through via holes to form a three-dimensional subsystem
enclosure that requires no further packaging. Merrimac Industries
facilities are registered under ISO 9000, an internationally
developed set of quality criteria for manufacturing operations.
Merrimac Industries, Inc. and its subsidiary
Filtran Microcircuits Inc., are located in West Caldwell,
NJ, San Jose, Costa Rica and Ottawa, Ontario, Canada, and
have approximately 240 co-workers dedicated to the design
and manufacture of signal processing components, gold plating
of high-frequency microstrip, bonded stripline and thick metal-backed
Teflon (PTFE) micro-circuitry and subsystems providing Total
Integrated Packaging Solutions® for wireless applications.
Merrimac (MRM)
is listed on the American Stock Exchange. Multi-Mix®,
Multi-Mix PICO™, MMFM® and Total Integrated Packaging
Solutions® are trademarks of Merrimac Industries, Inc.
For more information about Merrimac Industries, Inc. and Filtran
Microcircuits Inc., please visit http://www.merrimacind.com
and http://www.filtranmicro.com.
Contact:
Mason N. Carter, Chairman & CEO
973.575.1300, ext. 1202
E-mail: mnc@merrimacind.com
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