Multi-Mix® FAQ

1) What type of interfaces are available for Multi-Mix®?

2) What quality testing has Multi-Mix® been subjected to?

3) How does the Multi-Mix® process deal with the issue of hermeticity?

4) What is the coefficient of thermal expansion for the substrate materials used in Multi-Mix® technology?

5) How does the Multi-Mix® process dissipate unwanted heat?

6) What are the advantages of the process?

7) What are the limitations of the Multi-Mix® process in the area of:

Thickness?

Size?

Frequency (upper and lower limit)?

Air Gaps?

8) What type of resistors are used in the Multi-Mix® process?

1) What type of interfaces are available for Multi-Mix®?

Surface mount
- Suitable for pick-and-place assembly
- Compatible with microstrip or coplanar waveguide
Coplanar waveguide
- Frequencies through Ka Band
- Gold, ribbon bond surfaces

2) What quality testing has Multi-Mix® been subjected to?

Thermal cycling life test: 1000 plus cycles -65 to +125 degrees C
Themal Shock, Burn-In, Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Solder Heat

3) How does the Multi-Mix® process deal with the issue of hermeticity?

Substrate materials are hydrophobic, repelling moisture and high surface tension liquids.
Substrate materials absorb low tension liquids.
Hermetically packaged MMIC's are embedded within the multilayer module.
Non-hermetic MMIC's, embedded within the multilayer module, have passed rigorous screening (above).
Dielectrics
- (Er=2.94) moisture absorption = 0.1%
- (Er=3.00) moisture absorption = 0.1%
- (Er=6.15) moisture absorption = 0.1%
- (Er=10.2) moisture absorption = 0.1%
- (Er=3.38) moisture absorption = 0.06%
- (Er=4.50) moisture absorption = 0.01%

4) What is the coefficient of thermal expansion for the substrate materials used in Multi-Mix® technology?

Dielectric CTE well matched to metal CTE
Copper: CTE= 17 ppm/degrees C
Aluminum: CTE= 24 ppm/degrees C
Dielectrics
- (Er=2.94) CTE(x,y) = 16 ppm/degrees CCTE(z)= 24 ppm/degrees C
- (Er=3.00) CTE(x,y) = 17 ppm/degrees CCTE(z)= 24 ppm/degrees C
- (Er=6.15) CTE(x,y) = 17 ppm/degrees CCTE(z)= 24 ppm/degrees C
- (Er=10.2) CTE(x,y) = 17 ppm/degrees CCTE(z)= 24 ppm/degrees C
- (Er=3.38) CTE(x,y) = 11,14 ppm/degrees CCTE(z)= 35 ppm/degrees C
- (Er=4.50) CTE(x,y) = 14 ppm/degrees CCTE(z)= 20 ppm/degrees C

5) How does the Multi-Mix® process dissipate unwanted heat?

Thermal vias conduct heat away from active devices
Thermal vias achieve thermal resistance < 1 degree C / Watt

6) What are the advantages of the process?

Homogeneous dielectric provides superior microwave properties (loss tangent, dispersion)
Allows greater complexity of buried vias for interconnections

7) What are the limitations of the Multi-Mix® process in the area of:

A. Thickness?

There is no practical limitation on thickness or on the number of layers

Have manufactured MMFM's with 52 layers

B. Size?

Can typically process, but are not limited to 18 x 24 inch panels

Have the ability to form larger multilayer panels using the fusion bonding process

C. Frequency (upper and lower limit)?

Microwave through Millimeter wave

D. Air Gaps?

There are no unwanted air gaps in a fusion bonded multilayer

Have the ability to form cavities within the multilayer

Have the ability to utilize an air dielectric constant within the multilayer